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Mechanical
Specifications
Indium phosphide can be supplied as ingot
sections or as-cut, etched or polished wafers. All Indium
Phosphide wafers are individually laser scribed with ingot
and slice identity to ensure perfect traceability.
Packaging
Polished Wafers
Fluoroware type tray, individually sealed in two outer bags
in inert atmosphere.
As-cut Wafers
Fluoroware type tray or glassine bag.
‘Process Trial’ wafers
Fluoroware type tray,
individually sealed in one outer bag. |
If you do not see the specification you require,
please ask for details |
